About Innolume
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![Innovation, precision and reliability](/images/about-image-1.jpg)
Innolume is a comprehensive provider of photonic devices utilizing InGaAs/GaAs Quantum Well and Quantum Dot technologies, covering a wavelength range from 780 nm to 1350 nm.
![Quantum Dots Technology](/images/about-image-2.jpg)
Innolume specializes in developing customized photonic devices tailored to specific customer requirements. We offer the capability to produce these devices in mid-volume quantities in-house and seamlessly transfer the production to contract manufacturing for high-volume manufacturing, ensuring scalability and quality consistency throughout the process.
![Since 2004](/images/about-image-3.jpg)
Innolume was the first team to successfully bring QD semiconductor devices to the commercial market. In achieving this milestone, we also developed leading QW laser technology, solidifying our position at the forefront of photonics innovation.
![Our facilities](/images/about-image-4.jpg)
Two production-scale MBE reactors at Innolume support the epitaxial growth of In,Al,Ga,AsP/GaAs heterostructures, providing the flexibility and sustainability needed for both development and volume production
Conventional InGaAs QW structures cover the standard wavelength range of 780-1120 nm, whereas our proprietary InAs QD technology extends the attainable range of GaAs technology up to 1350 nm.
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Innolume’s capabilities in wafer processing include all steps of front-end fabrication, including Electron Beam Lithography and modern control techniques, to produce high-quality laser chips.
![Passivation technology](/images/about-image-6.jpg)
Proprietary surface passivation technology applied to the cleaved facets ensures outstanding lifetime performance for our entire range of high-power products. The finely controlled deposition of optical layers allows for achieving extremely deep antireflection coatings (<0.01% reflection), which is crucial for low noise performance in our Gain Chips used in external cavities and for low spectral ripples in our SOA and SLD products.
![Packaging Capabilities](/images/about-image-7.jpg)
Innolume excels in packaging capabilities, offering a wide range of solutions to meet diverse needs. Our chip-on-carrier options cover various form factors, ensuring compatibility with different applications. Additionally, we provide fiber-pigtailed modules that enhance connectivity and integration. Each module undergoes a rigorous burn-in procedure and careful outgoing quality control before shipment, guaranteeing reliability and performance.
Innolume is equipped with state-of-the-art testing equipment to thoroughly evaluate devices throughout the entire fabrication process. Additionally, Innolume conducts deep studies using advanced analytical tools, constantly upgrading them to optimize device performance.